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MC-7831-HA
NEC's 1 GHz GaAs CATV 18 dB PUSH-PULL AMPLIFIER
FEATURES OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE H02
45.08 MAX 38.10.25 3.2 MAX 27.5 MAX 4.25
+ 0.25 - 0.35
* SPECIFIED FOR INCREASED BANDWIDTH TO 1 GHz * GaAs ACTIVE DEVICES * LOW DISTORTION * HIGH LINEAR GAIN: MC-7831-HA - GL = 18 dB MIN at f = 870 MHz * LOW RETURN LOSS * LOW GAIN CHANGE OVER TEMPERATURE * SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE * HIGH RELIABILITY AND RUGGEDNESS: Withstands environmental extremes as well as Silicon devices (Surge, ESD, Etc.)
VDD 14.85 MAX 4.00.25 8.1 MAX 19.050.38 6-32 unc 2B 0.510.050 21.5 MAX 123 5 789 12.9 MAX 1 In 9 Out 5
25.40.25 2.540.25
2378 Gnd
NEC's MC-7831-HA is a GaAs Multi-Chip Module designed for use as input stages in CATV applications up to 1 GHz. Because this unit is a GaAs device, it has low distortion, low noise figure, and low return loss across the entire frequency band. Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using fully automated equipment to maximize consistency in part to part performance, and reliability is assured by NEC's stringent quality and process control procedures. These parts come in industry compatible hybrid packages.
PART NUMBER
2.62-0.35
DESCRIPTION
10.750.25
4.190.13
A 6.3 0.38.. A 2.5
2.540.38
0.05
APPLICATIONS
* CATV HEADEND SYSTEMS
* CATV OPTICAL NODES * CATV DISTRIBUTION AMPS
ELECTRICAL CHARACTERISTICS (TA = 305 C, VDD = 24 V, ZS = ZL = 75 )
MC-7831-HA TYP - - - - - - - - - - - - - - - - - - SYMBOLS BW GL S Gf1 Gf2 NF RLin Frequency Range Linear Gain Gain Slope Gain Flatness 1 Gain Flatness 2 Noise Figure 1 Noise Figure 2 Input Return Loss CHARACTERISTICS UNITS MHz dB dB dB dB dB dB 50 18.0 0.2 -0.35 -0.35 - - 20.0 19.0 17.5 16.0 10.0 20.0 19.0 17.5 16.0 12.0 180 MIN 1000 21.0 1.0 +0.35 +0.85 6.5 7.0 - - - - - - - - - - 240 MAX TEST CONDITIONS f = 870 MHz f = 40 to 870 MHz 40 to 870 MHz 40 to 1000 MHz f = 50 MHz f = 870 MHz 40 to 160MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz 870 to 1000 MHz 40 to 160MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz 870 to 1000 MHz RF OFF
RLout
Output Return Loss
dB
IDD
Operating Current
mA
Date Published January 2007
(Continued on next page)
MC-7831-HA ELECTRICAL CHARACTERISTICS (TA = 305 C, VDD = 24 V, ZS = ZL = 75 )
IDD CTB XMod CSO Operating Current Composite Triple Beat Cross Modulation Composite Second Order mA dBc dBc dBc 180 - - - - - - - 240 -57 -50 -57 RF OFF f = 40 to 870 MHz; 110 Channels, VOUT = 44 dBmV, Flat
ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 C)
SYMBOLS VDD VI TC TSTG PARAMETERS Input Voltage2 Supply Voltage Operating Case Temperature Storage Temperature V
UNITS dBmV C C
RATINGS 65 30
RECOMMENDED OPERATING CONDITIONS (Zs = ZL = 75)
SYMBOLS VDD Vi TC PARAMETERS Supply Voltage MC-7831-HA
1
UNITS MIN TYP MAX V dBmV C -30 +25 +85 23.5 24.0 24.5 - 21.0 27.5
-30 to +100 -40 to +100
Input Voltage MC-7831-HA
Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance.
Operating Case Temperature MC-7831-HA
Note: 1. Test Conditions: 110 Channels, Flat
ORDERING INFORMATION
PART NUMBER MC-7831-HA-AZ PACKAGE 7-pin special with heatsink (Pb-Free ) QUANTITY 25 pcs max/ Tray
NOTES ON CORRECT USE
1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. Recommended space is 2.0 to 3.0 mm typical. 2. Recommended torque strength of the screw is 59 to 78 Ncm. 3. Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering Method Pin Part Heating Soldering Conditions Pin area temperature: less than 260C1 Hour: Within 2 sec./pin Condition Symbol -
Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do agree to fully indemnify CEL for all damages resulting from such improper use or sale.
ucts can reasonably so at their own risk and
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Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -AZ (*)
-A Not Detected
Not Detected Not Detected Not Detected Not Detected Not Detected
If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.

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